Hewlett-Packard is developing a new packaging test methodology and limits spec. During our investigation of other industry specifications and standard organizations, we found that many are similar to each other. This was further clarified by Herb Schueneman who suggested that many of these specifications were derived from the Forest Products Laboratory Report 22 published in 1979 called "An Assessment of the Common Carrier Shipping Environment." Closer examination of this report reveals that the data reviewed was collected between 1959 - 1977 using spring mass recording devices.
Since then a number of companies have measured their own environments using consultants or internal resources; or have had a university conduct a general study and analysis. ASTM has also discussed measuring the distribution environment.
I would like to set up a meeting on August 21 in the San Francisco Bay Area (i.e. Palo Alto) to discuss the possibility of an electronics' industry study of the distribution environment. This would be under the antitrust protection of IoPP, and under the technical committee of P2C2 (Protective Packaging of Computer Components) which has an inactive task group call MADE (Measurement and Analysis of Distribution Environments).
Since the "environment" is much to large for the initial study, I suggest it be broken down into modules with domestic express environments being the first module studied.
The key players I'm looking for this meeting are:
Proposed Process (to start the discussion)
Items to be considered
That's it for now. Let me know if you are interested and please spread the word. The meeting is open to anyone with an interest in helping to better define the project.