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Cold Chain Distribution

Materials, Testing, & Technology

  • Product Protection Test Book

    • This is a Hewlett-Packard public manual intended as a guide for packaging professionals. It provides detailed information to aid selection of the most effective product/package tests and test levels. It will further guide companies in planning and managing package development and testing for new products so they can survive the distribution environment. (versions available English, Simplified Chinese, and Traditional Chinese)

  • ECT from a User’s Perspective - February 18th, 2002  - Hewlett-Packard public paper
    • Presented at Dimensions02 ( Paper - MS Word or PDF)
  • A Simplified Process for Determining Cushion Curves: The Stress-Energy Method - Dimensions 2006 - Hewlett-Packard public paper
  • EMEA MADE European Express Shipping Drop / Impact Study - Dimension 2006  - Hewlett-Packard public paper
  • MADE Final Report, published August 11, 1999.   - Hewlett-Packard public paper
    • Presented at the 2000 IoPP 17th Educational Symposium on Transport Packaging 
    • Presented at the 2000 ISTACON conference
  • "Industry Efforts to Improve Measurement and Analysis of the Distribution Environment" published in the IoPP 14th Educational Symposium on Transport Packaging proceedings, February 1997.  - Hewlett-Packard public paper
    • Presented at the 1997 IoPP 14th Educational Symposium on Transport Packaging
  • A Study of ESD Corrugated, published 1999  - Hewlett-Packard public paper
    • Electrostatic Discharge (ESD) corrugated protective packaging is evolving to the point where new testing procedures need to be implemented in the evaluation process. This paper will serve as a general overview in outlining some test methods aimed at the qualification process for ESD corrugated and attempt to provide some understanding of what differentiates one ESD packaging product from another.

Graphics & Printing

Environment and Regulations

ESD

Supply Chain & Logistics

  • Supply Chain Cube Cost (SC3): Reducing Supply Chain Cost Through Product Design - Dimensions 2005 -  - Hewlett-Packard public paper
  • The future of the supply chain and the importance of smart packaging in containing costs - September 8, 2004 -  - Hewlett-Packard public paper
  • Web-cast: Beyond packaging postponement: cutting costs while driving sales
    Collaborating on All-in-One product design and packaging to enable supply chain efficiency
  • Web-cast: Beyond packaging postponement: cutting costs while driving sales
    Packaging postponement of HP's DeskJet printers
  • Web-cast: Beyond postponement: regional logistics effectiveness
    Groundbreaking packaging work allowed hp to postpone the distribution and customization processes in the regional fulfillment centers, providing a global solution with regional fulfillment strategies.

Software and Tools

RFID

Process Improvement

  • Toward a Packaging Information Process Model   - Hewlett-Packard public paper
  • Web-cast: Packaging to win: gaining the competitive edge
    HP was able to improve its packaging processes through a benchmarking investigation examining competitors' methods to ultimately maximize packaging opportunities and drive business results.
  • How Hewlett-Packard is using Benchmarking to Drive Packaging Cost Reductions and Quality Improvements - February 8, 2002   - Hewlett-Packard public paper
    • Presented at the Business Intelligence for the Manufacturing Industry Conference (Paper - MS Word, PowerPoint)
  • Managing Packaging as a Horizontal Process - February 18th, 2002  - Hewlett-Packard public paper
  • "Selling Packaging to your CEO" published in the Dimensions.01 Symposium proceedings, February 27, 2001.  - Hewlett-Packard public paper ( Paper - MS Word Adobe PDF)
  • "Hewlett-Packard's Packaging Supplier Evaluation Process and Criteria" published in the IoPP 16th Educational Symposium on Transport Packaging proceedings, February 1999   - Hewlett-Packard public paper
    • Presented at the 1999 IoPP 16th Educational Symposium on Transport Packaging 
    • Presented at the 1999 PMMI Pack Expo Las Vegas Solutions '99 Workshops
 
   
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